WH Leary News

W. H. Leary Company of Tinley Park, Ill. recently met with Versor Engineering of Bydgoszcz, PL at the Leary Headquarters to confirm their new partnership.  This cooperation makes Leary the preferred supplier of gluing and inspection systems for Versor Engineering’s folder-gluers.

The idea was set into motion following drupa 2016, and the success of Versor’s Open House in 2018. 

"There is growing pressure in the industry to reduce machine set-up time and improve overall carton quality”, says Chris Leary, Director of Sales at W.H. Leary Company.  "This collaboration with Versor allows us to better integrate our system into their folder-gluer, and gives the operator a smarter finishing line.”  

Versor Engineering focuses on modern carton folding solutions, priding themselves to meet the highest possible quality standards with their machinery.  W. H. Leary Company provides glue application, quality assurance and data collection solutions which enable users to increase finishing productivity, decrease un-scheduled machine downtime, and guarantee folding carton quality.  

Visitors to drupa 2020 can look forward to seeing these new innovative technologies demonstrated at the Versor booth and Leary booth respectively. 

"The Leary Company is better known in North America, and we are happy to be able to offer their systems on our machines in other markets.  The Leary system fits well in our range of finishing solutions which also include in-line Braille embossing; the EyeC print inspection camera; in-line tape application; and ejection systems”, says Tadeusz Figurski, Director at Versor Engineering.      

Kevin Leary, CEO of W. H. Leary Company affirms, "We are excited about this cooperation with Versor Engineering from a development and commercial perspective.  At drupa the industry will get a chance to see the latest advancements in folder-gluer operation.”

Image: Slawek Zawomi, CEO for Versor Engineering [LEFT] and Chris Leary, Director of Sales for W. H. Leary [RIGHT] commemorating their partnership agreement.

USA | 16th August 2019